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3D dToF

Product Overview

3D dToF, based on single-photon detection (SPAD) technology, enables direct measurement of spatial distance by capturing photon-level time-of-flight information. This technology does not rely on phase calculations; instead, it rapidly constructs high-precision three-dimensional spatial information by recording the time difference between laser pulse emission and return, featuring long ranging range, high temporal resolution, and fast response speed. SI 3D dToF products employ high-performance SPAD arrays and advanced on-chip signal processing architecture, achieving integrated processing from photon reception and data conversion to depth calculation, maintaining stable performance even in complex environments such as low light and strong light. With its high-precision and high-reliability three-dimensional perception capabilities, the products can be widely applied in fields such as mobile phone spatial perception, AR/VR, intelligent robots, industrial measurement, and autonomous driving, providing accurate spatial awareness capabilities for next-generation smart terminals.

Product List
  • SIF7010

    The SIF7010 is a direct time-of-flight (dToF) 3D CMOS image sensor with an optical size of 1/18 inch (800 × 600 μm²). ...

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Application
Product Advantages
  • More details, smaller pixel size

    high resolution

  • Industry-leading BSI process, higher QE (quantum efficiency)

    High sensitivity

  • Low noise, more accurate depth rendering

    High precision

  • Global shutter exposure, faster motion capture

    High frame rate