SI provides comprehensive semiconductor solutions for smartphones, with products integrated throughout the device, including front-facing, internal, rear-camera, haptic, and audio subsystems. A 3D iToF image sensor can be used in the front camera to enable 3D spatial recognition, while ambient light, proximity, and multi-function optical sensors support ambient light detection and proximity sensing. The rear camera module can incorporate flicker sensors, OIS driver ICs, dToF ranging sensors, and multispectral sensors to enhance imaging performance. A haptic linear motor provides vibration feedback across the device, while an audio SoC and smart audio amplifier support a wide range of audio applications.