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SIF7010

The SIF7010 is a direct time-of-flight (dToF) 3D CMOS image sensor with an optical size of 1/18 inch (800 × 600 μm²). This sensor employs BSI and NIR plus technologies to improve quantum efficiency, thereby enhancing PDE. Target relative distance accuracy and precision are 1% of the measured distance. The sensor supports features such as region of interest (ROI), software binning, reduced depth resolution, and flexible frame control and configuration. It operates in global shutter mode, with a maximum frame rate of 60 fps for raw histogram or direct depth output. Data is transmitted via a standard MIPI interface. It includes standard IIC and SPI interfaces for receiving and providing control from external devices. The SIF7010 is targeted for AR/VR and 3D modeling applications, targeting low-power mobile platforms such as smartphones, tablets, PCs, and IoT devices.

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Product Features

  • 1/18-inch optical size

  • 40 × 30 resolution

  • 20 × 20 um² pixels

  • 4-in-1 software merging (software binning)

  • 1% absolute distance accuracy

  • 1% relative distance accuracy

  • Region of Interest (ROI) feature

  • Depth resolution reduction function

  • Adjustable PDE to mitigate pile-up mitigation

  • TDC self-calibration

  • Up to 60fps raw histogram or direct depth output (typically 15fps)

  • Multi-device anti-interference function

  • I2C slave interface, used for configuration and control.

  • SPI master interface, used for peripheral configuration.

  • Standard MIPI interface

  • Flexible frame control and configuration

Application scenarios

Sample application

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