SI comprehensively covers all categories of wearable devices, including VR headsets, smart glasses, smartwatches, smart rings, and TWS smart earphones, and has built six major chip product lines: machine vision, imaging, optical sensing, intelligent audio, vibration sensing, and health sensing. VR devices are equipped with 3D iToF and 3D dToF LiDAR for spatial positioning, combined with light/proximity light sensors, audio amplifiers, and linear motor drives for controllers; smart glasses are equipped with single-point dToF imaging, environmental and proximity light sensors, and a complete set of audio chips; watches and rings focus on health monitoring, optical sensing, and haptic motors, with watches additionally equipped with optical rotary encoders; TWS earphones integrate dToF, temperature sensing, multiple types of optical sensors, and vibration drives, and can provide complete chip solutions for the lightweight, interactive, health, audio-visual, and spatial recognition needs of different wearable products.